华为余承东：首款为原生鸿蒙而生的新形态手机 3月见
2月24日，华为常务董事、终端BG董事长、智能汽车解决方案BU董事长余承东今日在微博发视频对“新形态手机”进行预热。
24
Feb
24
Feb
蓝思携手灵伴，“会提词”的AI眼镜将在长沙实现量产
2月22日，蓝思科技与AI交互领域领军企业杭州灵伴科技（Rokid）宣布达成深度战略合作，共同推动AI眼镜产业链的技术革新与商业突破。此次合作不仅标志着AI眼镜从单点技术创新迈向全链条生态构建，更为2025年全球AI眼镜出货量的爆发式增长提供坚实支撑。
24
Feb
机构：2024年中国主力电视机品牌出货量份额首超韩国
据韩联社2月23日报道，英国市场调研机构Omdia公司23日发布的数据显示，2024年中国电视机品牌TCL、海信、小米的合计出货量在全球市场所占份额为31.3%，首次超过韩国的三星和LG（28.4%）。
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Feb
创维、京东方、京东合推万元百寸Mini LED电视
2月21日，记者获悉，创维、京东方、京东联合推出万元级100英寸低反光Mini LED背光液晶电视（简称Mini LED电视），欲抢占更多OLED电视在国内高端彩电市场的份额。
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Feb
Dixon Technologies eyes US$3 billion display unit, seeks Indian government backing
Dixon Technologies, India’s largest electronics manufacturing services (EMS) provider, is pushing to build a US$3 billion display fabrication unit, contingent on government support through the India Semiconductor Mission 2.0 (ISM 2.0).
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Feb
Bridging cultures: Foxconn’s strategy for a unified Nissan partnership
Cultural differences have long complicated Renault’s collaboration with Nissan and Mitsubishi Motors, raising the possibility that the French automaker may strengthen its ties with Geely instead. Against this backdrop, Foxconn appears less interested in taking sides than in finding common ground.
24
Feb
STMicro, AWS co-develop AI-focused photonic chip for data centers
STMicroelectronics (STM) is partnering with Amazon Web Services (AWS) to develop a data center photonic chip that delivers 800Gbps and 1.6Tbps optical interconnect speeds for AI and high-performance computing (HPC) workloads. AWS plans to integrate the chip into its internal infrastructure.
24
Feb
Nissan denies closure of Thailand plant; pledges to expand HEV investment instead
Nissan has dismissed speculation that it plans to shut down its factory in Thailand, reaffirming the country’s role as a key manufacturing hub in the Association of Southeast Asian Nations (ASEAN). The company also expressed its commitment to supporting the Thailand government’s transitioning projects to electric vehicles (EVs).
24
Feb
India roundup: Kaynes SemiCon expands global presence, nears OSAT customers in Japan and US
India-based OSAT Kaynes Semicon is securing customers in its foray into the semiconductor business. Tesla steps up entry in India but faced criticism over its potential local manufacturing prospect.
24
Feb
Samsung to launch LPW DRAM in 2028, touted as ‘mobile HBM’ for on-device AI
As AI applications advance, the demand for high-performance and energy-efficient memory is growing across on-device AI, high-performance computing (HPC), and data centers. In response, Samsung Electronics (Samsung) plans to introduce low power wide I/O (LPW) DRAM in 2028, a next-generation memory technology designed to enhance on-device AI performance and solidify its leadership in the mobile memory sector.