09
May
Raydium Semiconductor Corporation reported consolidated revenue of NT$5.83 billion (approx. US$191.7 million) for the first quarter of 2025, up 2.4% from the previous quarter but down 3.5% year-over-year. Gross margin slipped slightly to 29.5%, edging down 0.1pp both sequentially and annually. Operating profit rose 23.2% quarter-over-quarter to NT$460 million, though it marked an 18.0% decline compared to a year earlier.
09
May
WT Microelectronics sees minimal impact from US tariffs as semiconductor market rebounds in 2Q25
WT Microelectronics, a Taiwan-based IC distributor, reports that the impact of US tariffs on its operations remains minimal, as most components are exempt from such duties. WT Microelectronics chairman Eric Cheng notes that while certain sectors like smartphones, PCs, and servers have experienced accelerated inventory replenishment due to tariffs, the overall semiconductor industry is unmistakably emerging from its trough in the second quarter of 2025.
09
May
TSMC sets April revenue record at US$11.55 billion; YTD tops US$33 billion
TSMC, the world’s top contract chipmaker, posted consolidated revenue of NT$349.57 billion (approx. US$11.55 billion) in April 2025, up 22.2% from March and 48.1% from a year earlier. The figure exceeded the NT$300 billion mark and surpassed the previous monthly record of NT$314.24 billion set in October 2024. April marked TSMC’s 16th straight month of annual revenue growth.
09
May
US and UK reach breakthrough trade agreement as Trump signals strategic realignment
On May 8, US President Donald Trump and British Prime Minister Keir Starmer jointly announced the near-finalization of a long-anticipated bilateral trade agreement between the United States and the United Kingdom.
09
May
Lee Jae-Yong’s 10-year smart M&A strategy builds Samsung’s technology ecosystem
Over the past decade, Samsung Electronics executive chairman Lee Jae-Yong has leveraged global mergers and acquisitions (M&A) to transform Samsung into a “technology-first” company. Rather than pursuing large-scale deals, Lee has focused on strategic acquisitions that strengthen core technologies. These efforts have laid the foundation for Samsung’s competitiveness in semiconductors, automotive electronics, AI, and display sectors.
09
May
WITS initiates acquisition plan to seek second growth curve
Wistron ITS (WITS) chairman and CEO Ching Hsiao pointed out that the model launched by DeepSeek brings a dawn of AI popularization, driving more AI applications. This will be a key area for WITS to leverage. The company expects AI-related revenue to increase from 12–15% in 2024 to 20%. At the same time, WITS will also launch an acquisition plan, with results expected before the end of the year.
09
May
FX losses erase over 40% of Acer’s 1Q25 operating profit
Acer Inc. delivered solid operating results for the first quarter of 2025, but sharp foreign exchange losses undercut its profitability. The company reported NT$445 million (approx. US$14.7 million) in forex losses—equal to 42% of its operating income—according to financial results approved by the board on May 8. With the New Taiwan dollar rising rapidly in the second quarter, investors are closely watching whether currency-related losses will escalate.
09
May
Japan’s Denso, Rohm forge chip alliance targeting EVs and autonomous driving
On May 8, Japanese automotive parts supplier Denso and chipmaker Rohm Semiconductor announced a strategic partnership aimed at deepening collaboration in semiconductor development and production. Citing reports from Nikkei and Car Watch, the companies said the alliance will span joint chip development, integrated manufacturing, and coordinated raw material procurement, with implementation details to be finalized later.
09
May
Taiwan ODMs post record April; server momentum set to drive 2Q25 growth
Taiwan’s leading ODMs reported robust year-over-year revenue growth in April, driven by solid notebook and server shipments. Although early notebook pull-ins have weakened, demand for servers, especially AI servers, remains strong and is set to underpin growth in the second quarter.
09
May
Chiplets technology gains ground as global semiconductor giants invest in modular chip future
TSMC, Intel, Samsung Electronics, and Advanced Micro Devices (AMD) are backing the modular semiconductor approach that breaks down system-on-chip (SoC) designs into smaller functional units as the US$107 billion to US$384 billion market takes shape.