As AI embraces rapid developments, the future of AI-driven lifestyles will rely heavily on display technology. According to Taiwan’s Industrial Technology Research Institute (ITRI), display technology is becoming integral to three key AI edge devices: TVs, AR/VR glasses, and smart cockpits. Leveraging the technological advantages of Micro LED, the emerging era of “AI of Things” (AIoT) is set to position Taiwan’s display and sensor industries at the forefront of a new market.

Strong AI-related demand will drive TSMC’s 20% compound annual growth rate in revenue over the next five years, according to chairman C.C. Wei during the company’s latest earnings call. This optimistic outlook aligns with broader server supply chain indicators, as order and shipment volumes demonstrate continued momentum in AI server demand, even amid concerns about GB200 shipments.

The US Department of Commerce announced on January 16, 2025, that the CHIPS Program’s National Advanced Packaging Manufacturing Program (NAPMP) has finalized US$1.4 billion in awards to strengthen US leadership in advanced packaging. This funding will support both the validation and transition of new technologies to large-scale domestic manufacturing, with the goal of creating a self-sustaining, high-volume advanced packaging industry within the US.