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06 Feb

AMD flags 2H26 turning point as MI450 shipments stay on track

February 6, 2026
By jeff

AMD’s next-generation MI450 AI accelerator remains on schedule for launch and volume production in the second half of 2026, with CEO Lisa Su signaling confidence that supply capacity will not constrain deliveries as the company steps up its push in high-end AI chips.

06 Feb

Latest News and Trends

U-Power accelerates high-voltage charging stations amid rising EV high-power charging demand

February 6, 2026
By jeff

Electric vehicle (EV) charging company U-Power is targeting growing opportunities in the market, with chairman Bob Chen noting that the company has already installed roughly 60 charging stations across Taiwan, and is aiming to increase this number to 100 by the end of 2026.

06 Feb

Latest News and Trends

MetaOptics drives heat-resistant metalenses into CPUs

February 6, 2026
By jeff

At the Asia Photonics Expo (APE 2026) in Singapore, DIGITIMES interviewed MetaOptics, the first planar lens company listed on the Singapore Exchange’s Catalist board. Aloysius Chua, the company’s deputy CEO, outlined MetaOptics’ latest technological advances and global footprint, with a particular focus on its progress in co-packaged optics (CPO).

06 Feb

Latest News and Trends

India’s 2026–27 budget signals systemic overhaul for manufacturing, semiconductors, and digital investment

February 6, 2026
By jeff

India’s Union Budget for fiscal year 2026–27, unveiled on February 1, 2026, emphasizes manufacturing, semiconductors, and AI-linked infrastructure as central pillars of economic growth. The measures aim to strengthen supply chains, reduce import dependence, and institutionalize compliance frameworks for both domestic and foreign investors.

06 Feb

Latest News and Trends

Japanese firms in Vietnam see Chinese counterparts as expansion competitors

February 6, 2026
By jeff

A recent survey by the Japan External Trade Organization (JETRO) shows that Japanese companies operating in Vietnam remain committed to expansion, even as they increasingly view China as their main competitive threat.

06 Feb

Latest News and Trends

Pegatron partners with Sysgration to expand BBU for US-made AI servers

February 6, 2026
By jeff

Pegatron and Sysgration announced a strategic partnership on February 5, under which Pegatron will invest NT$.21 billion (US$38.3 million) in Sysgration through a private placement of common shares. Pegatron will subscribe to 22,000 shares at NT$55 per share, bringing the total size of the funding round to NT$1.375 billion.

06 Feb

Latest News and Trends

HTC expedites AI glasses sales with channel expansion, ecosystem growth

February 6, 2026
By jeff

Following the launch of its first AI smart glasses, Vive Eagle, HTC has continued to roll out operational initiatives, including expanding sales regions, building out its ecosystem and services, adding new channel partners, and refining product compatibility and lineup to drive overall sales momentum for its AI glasses.

06 Feb

Latest News and Trends

Transcend sees 4x revenue surge in January 2026 as memory prices rise

February 6, 2026
By jeff

Memory module maker Transcend Information reported a record high monthly consolidated revenue of NT$4.76 billion (US$150.4 million) in January 2026, driven by soaring demand for AI servers, large-scale industrial control shipments, and steadily rising memory prices.

06 Feb

Latest News and Trends

Samsung foundry said to plan 10% price hike for 4nm, 8nm nodes

February 6, 2026
By jeff

Samsung Electronics’ foundry business is reportedly preparing price increases for certain process technologies, including 4nm and 8nm nodes, with hikes reportedly around 10%. Despite the adjustment, Samsung is expected to maintain a pricing advantage over TSMC as TSMC continues to raise its own wafer prices.

06 Feb

Latest News and Trends

TSMC’s 3nm bet in Japan signals a deeper Taiwan-Japan tech pact

February 6, 2026
By jeff

To meet the surging demand driven by AI, TSMC is upgrading its second wafer fab under construction in Kumamoto, Japan, to use more advanced 3nm process technology. This development was personally conveyed by TSMC chairman C.C. Wei to Japanese Prime Minister Sanae Takaichi.

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