As artificial intelligence (AI) strains data center cooling limits, a seismic shift from traditional air systems to liquid cooling solutions is reshaping the US$5 billion thermal management market, industry analysts say.
According to ET News, SK Hynix is setting its sights on the semiconductor packaging market by offering packaging foundry services, a move that analysts say capitalizes on its expertise in high bandwidth memory (HBM).
Following Huawei’s recent advancements, TCL, a leading Chinese home appliance brand, has revealed its dual-folding technology, signaling potential plans for a tri-fold smartphone. This move has sparked industry speculation on whether Samsung Electronics will join the competition in the tri-fold smartphone segment.
Taiwan-based HDI board manufacturer Compeq experienced robust revenue performance in November, driven by the heightened demand for tablets and notebooks, steady shipments of low Earth orbit (LEO) satellites, and substantial orders for new models from Chinese mobile phone manufacturers.
In response to the US export control regulations introduced on December 2, China’s Ministry of Finance issued a notice on December 5 regarding government procurement standards and implementation policies for domestic products, proposing to give local products a 20% advantage in bid evaluations.