CSPs accelerate custom chip adoption amid ASIC market expansion

AWS announced significant cloud developments and custom chip design progress at its major conference in the US this week. The company’s next-generation 3nm chip, Trainium 3, is set to launch in 2025, with industry sources suggesting Taiwan-based ASIC company Alchip will lead its development. Additionally, AWS is reportedly finalizing a long-term ASIC collaboration agreement with Marvell, demonstrating strong market demand. Industry insiders remain optimistic about the ASIC market’s long-term prospects.

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Sensor maker FineTek expands production amid surging server liquid cooling orders

FineTek, a leading Taiwanese sensor manufacturer, is experiencing a sharp increase in orders from server ODM clients this December, driven by the mass production of Nvidia’s GB200 liquid-cooled servers. The company anticipates continued strong momentum beyond the first quarter of 2025, with expectations of “astounding” order volumes in the second quarter.

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LEO satellites face triple hurdles: launch capacity, cost, and spectrum management

For all the buzz about digital transformation in the satellite industry, analog technology still dominates in space. That’s the message from Shey Sabripour, founder and CEO of CesiumAstro, who addressed industry leaders at TASTI 2024 as the sector grapples with critical bottlenecks in launch capacity and spectrum management amid the deployment of new low-Earth orbit (LEO) constellations.

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