TSMC announced at the Open Innovation Platform (OIP) Ecosystem Forum in Europe that its CoWoS packaging technology will achieve certification by 2027, introducing a version with 9x reticle size. This advancement will accommodate twelve HBM4 memory stacks, providing unprecedented performance enhancements for artificial intelligence (AI) and high-performance computing (HPC) chips.

Global smartphone shipments have slowed in recent years due to high inflation, market saturation, and extended replacement cycles. However, the surge in generative AI (GenAI) has injected new life into the stagnant market, with global smartphone demand projected to grow 5% year-over-year, reaching nearly 1.2 billion units in 2024.

Wind energy provides advantages over solar power, generating electricity at any time when wind is available. Onshore turbines typically deliver 2.5–3 MW, while offshore turbines range from 3–6 MW, enough to power medium-sized data centers with a few units. Due to considerations around land costs, noise, and aesthetic concerns, turbines are often placed in remote areas with stronger winds and unobstructed airflow, reducing community resistance and boosting efficiency.

Aaeon Technology faced headwinds in 2024 as weak demand slowed inventory clearance, but CEO Howard Lin anticipates recovery beginning in the fourth quarter of 2024 when customers resume ordering. This upturn is expected to drive the booking-to-billing ratio above 1, indicating a sector recovery that should continue with sequential growth into 2025.