As the world’s largest aftermarket (AM) car door handle manufacturer, Taiwan-based Hu Shan Autoparts has been actively advancing its “AM 2.0” product strategy in recent years. This initiative targets the mid-to-high-price market by offering premium upgraded components, aiming to enhance both quality and profitability.
According to Infineon’s press release, the company is advancing its 8-inch silicon carbide (SiC) technology, having released its first products in the first quarter of 2025. These products, produced in Villach, Austria, will offer premium SiC power solutions for high-voltage applications such as renewable energy systems, trains, and electric vehicles.
With the global semiconductor market projected to exceed US$1 trillion within the next decade, IC packaging and testing leader ASE is accelerating its overseas expansion. The company’s fifth factory in Penang, Malaysia, officially opened on February 18, 2025.
On February 18, Gogoro held a spring press conference, where Interim CEO Henry Chiang stated that as an energy technology and scooter company, Gogoro has a clear goal: achieving profitability and sustaining steady growth.
Chip manufacturers are actively promoting price rises in the second quarter, leading to an expected rise in DRAM and NAND flash prices during this period.
Acer CEO Jason Chen confirmed in a UK interview that the company will raise prices on US-bound laptops made in China by 10% next month in response to Trump’s tariffs. He also hinted at possible production shifts beyond China, including manufacturing in the US, The Telegraph reported.
Win Semiconductors, the leading gallium arsenide (GaAs) foundry, sees signs of recovery after industry downturns. As demand for mobile phones and Wi-Fi power amplifiers stabilizes, growth in optical communications and Wi-Fi 7 is expected to drive a rebound, positioning the company for a stronger market presence.