Samsung Electronics, facing difficulties in its wafer foundry business, has implemented cost-cutting measures, including the cancellation of on-site events and a slowdown in investment. Experts suggest that for Samsung to regain its competitive edge in the semiconductor market, it needs to restructure its organization and clarify its division of labor.

TSMC has taken the unusual step of opening up its Chip-on-Wafer-on-Substrate (CoWoS) outsourcing opportunities and recently announced a memorandum of understanding (MOU) with Amkor. TSMC’s front-end wafer fabrication plant in Arizona will closely collaborate with Amkor’s back-end packaging and testing facility to streamline the product manufacturing cycle.

Samsung Electronics and Nvidia have reportedly completed the on-site inspection of the fifth-generation high bandwidth memory (HBM3E). Despite delays in mass production and supply, earlier issues related to power consumption and thermal performance have been resolved. This progress strengthens Samsung’s position in the competitive memory market, though ongoing developments in its collaboration with Nvidia, especially in light of competition from SK Hynix, remain worth watching.

Reports suggest that the Chinese government is discouraging local companies from purchasing Nvidia’s AI chips, which may affect Samsung Electronics’ High Bandwidth Memory (HBM) sales. Newsis reported that Samsung is currently supplying HBM for Nvidia’s H20 custom chips for China. This marks the first instance of Samsung’s HBM3 being used in Nvidia’s chips. If the Chinese government implements a ban, the impact on Samsung could be significant.