TSMC, Amkor sign MOU for advanced packaging at US facility, Apple to be first customer

TSMC and Amkor Technology, the world’s second-largest semiconductor packaging and testing firm, announced on October 4 the signing of a memorandum of understanding (MOU) to deliver advanced packaging and testing services in Arizona. This collaboration aims to enhance the state’s semiconductor ecosystem, bolstering its competitiveness in the global market.

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Taiwanese supply chain resilient against Typhoon Krathon; global concerns shift to labor strikes and geopolitical tensions

Typhoon Krathon has hit Taiwan with significant force, moving slowly across the island. As of October 3rd, southern Taiwan, including Kaohsiung, Tainan, and Pingtung, is experiencing its third consecutive day off, while northern counties and cities have had two days off. Given Taiwan’s critical role in the global supply chain, concerns are mounting about whether the typhoon will affect the stability of the ICT industry’s supply during the traditionally slower fourth quarter of 2024.

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Apple to source OLED panels from China for next-gen iPhone SE

According to industry sources, Apple has begun sourcing OLED panels from BOE and other Chinese manufacturers for its next-generation iPhone SE series. Rumors suggest that Apple plans to transition all iPhone models to OLED displays after 2025. Reports indicate that the company has already started placing orders for OLED panels for the upcoming iPhone SE from suppliers such as BOE and LG Display (LGD).

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Hyundai Motor launches ambitious battery production strategy

Hyundai Motor has unveiled its battery self-production plan, marking a significant step into in-house electric vehicle (EV) battery manufacturing. With several automakers, including Tesla, attempting to produce their own batteries with limited success, industry observers will closely watch Hyundai’s ability to navigate this complex venture as it charts its own course.

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China’s AI compute power gap spurs rise of 10,000 GPU interconnected networks

The 2024 China Computing Power Conference highlighted the ongoing challenges in China’s AI computing capabilities. Experts emphasized the need to address China’s computing power gap by developing an interconnected compute network and utilizing other technologies to enhance overall performance, primarily due to the limitations of domestic GPU single-card performance.

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Global and Taiwan AI healthcare markets estimated to see robust CAGR from 2023 to 2030, says DIGITIMES Research

The market size of AI applications for healthcare was US$19.2 billion in 2023, and DIGITIMES Research estimates that the market will grow at a compound annual growth rate (CAGR) of 35.8% to reach US$159.7 billion in 2030. Taiwan’s AI healthcare market was NT$360 million (US$11.32 million) in 2023 and is expected to grow at a CAGR of 17.3% to reach NT$1.12 billion in 2030, according to DIGITIMES Research’s latest report covering the AI healthcare market.

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