Hanmi Semiconductor strengthens ties with India amid Micron facility launch

South Korean thermal compression bonder leader Hanmi Semiconductor has announced the development of the industry’s first dual-function BOC COB Bonder, capable of performing both Board-on-Chip (BOC) and Chip-on-Board (COB) processes within a single system, according to Yonhap News Agency and Maeil Business Newspaper. The company says the equipment is designed to improve process flexibility and production efficiency for high-performance memory products.

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Column: US drone policy reshapes supply chain opportunities for Taiwan

On June 6, 2025, US President Donald Trump signed two executive orders—”Unleashing American Drone Dominance” and “Restoring American Airspace Sovereignty”—mandating that the US drone industry exclude technology, parts, and materials from controlled countries (China, Russia, Iran, North Korea). The orders encourage adopting allied technologies to build an autonomous, resilient domestic ecosystem supporting the low-altitude economy and critical defense needs.

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Glass fiber shortage hits IC substrates, MGC follows Resonac with 30% CCL price hike

Demand from Nvidia and Apple has intensified shortages of high-end glass fiber cloth used in IC substrates, driving broad price increases for related materials and squeezing profit margins for copper clad laminate (CCL) suppliers. Japanese materials makers have recently taken the lead in raising prices, shifting rising costs downstream to customers and end markets.

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WT Microelectronics sees 2026 growth despite memory price hikes

The semiconductor market in 2026 is expected to be driven by strong AI demand but faces challenges from rising prices of memory and passive components. WT Microelectronics said the impact of memory price increases, along with localized hikes in passive component costs, remains manageable for its operations. Data center expansion is also fueling a surge in power IC demand, positioning WT Microelectronics’ 2026 momentum to surpass that of 2025. The company plans to continue investing in high-growth sectors such as data centers and servers.

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Egis showcases satellite and drone integration at MWC 2026

Egis Technology and its subsidiaries are jointly exhibiting at the 2026 Mobile World Congress (MWC 2026). Centered on integrated terrestrial and space connectivity, physical AI, and low-power intelligent computing, the group is highlighting its comprehensive capabilities in satellite IoT, edge AI visual perception, drone system integration, ultra-low latency wireless transmission, and ultra-low power AI chips.

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The new Apple Studio Display XDR and Apple Studio Display go official

Apple has unveiled a new generation of Studio Displays designed to elevate both professional workflows and everyday computing, marking one of the company’s most significant expansions of its display lineup in years. The updated Apple Studio Display (2026) retains its 27‑inch 5K Retina panel with 600 nits of brightness but now includes a sharper 12MP Center Stage camera with Desk View support, a…

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