Zhen Ding Tech Group, a leading PCB manufacturer, has recently welcomed its new General Manager, Chen-Fu Chien, who outlined the company’s future vision for smart manufacturing and digital transformation during a recent earnings call.

Japan’s 2025 budget proposal is on the verge of approval, paving the way for government investment in Rapidus, a project focused on the mass production of advanced semiconductors. This legislative session is also set to introduce legal changes allowing debt guarantees for bank loans, thereby strengthening governmental support. Although public funding is progressing steadily, private investment is noticeably slow, placing a significant financial responsibility on state resources.

On March 10, BOE Technology Group celebrated the mass production launch of its MLED (Mini/Micro LED) displays at Zhuhai BOE MLED Technology. The event, themed “Illuminating the Future, Mass Production Begins,” welcomed over 50 international clients from the US, Europe, Japan, South Korea, and Southeast Asia, highlighting BOE’s expanding footprint in the global MLED market.

High bandwidth memory (HBM) major client Nvidia is said to have visited Samsung Electronics’ advanced packaging plant again, just over a month after their last visit. Industry sources speculate that Samsung is supplying fifth-generation HBM3E and has entered the final stage of quality testing.