Etron’s eYs3D debuts multi-sensor chips for robotics and UAVs

Etron Technology’s subsidiary eYs3D Microelectronics has achieved new milestones in visual sensing technology with the launch of multi-sensor control chips for robots and unmanned vehicles. The company’s solution includes a proprietary AI platform featuring multimodal vision-language model (VLM) capabilities, providing clients with a comprehensive reference design for testing.

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Kioxia targets GenAI growth with plan to double AI NAND share

Kioxia, which recently listed on the Tokyo Stock Exchange (TSE), has announced plans to double its market share in AI-focused NAND products. President Nobuo Hayasaka highlighted the surging demand for AI-driven applications as a primary growth driver. He also called on major shareholders Bain Capital and Toshiba to reduce their stakes within three years to bolster Kioxia’s operational independence.

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SK Hynix lands US$458 million CHIPS Act grant

The US Department of Commerce has awarded SK Hynix a grant of up to US$458 million under the CHIPS and Science Act (CHIPS Act), supporting the company’s efforts to strengthen the AI supply chain in the US. The funding will support the establishment of a research center in Indiana focused on next-generation high bandwidth memory (HBM) and advanced packaging R&D.

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