04
Mar
04
Mar
Lenovo unveils a 2D/3D Hybrid Dimensional 34-inch Curved Monitor Concept
04
Mar
Lenovo unveils a concept AI display with built-in NPU
04
Mar
BYD weighs third European factory to dodge rising tariffs
With the European Union (EU) increasing tariffs on Chinese electric vehicle (EV) imports, BYD is ramping up its localization efforts to minimize the impact. The company is evaluating potential sites for a third European factory and expects to finalize its decision within the next 18 months, according to Executive Vice President Stella Li.
04
Mar
Small language model competition intensifies as Microsoft expands portfolio
Microsoft is advancing small language models (SLM), introducing Phi-4-multimodal and Phi-4-mini after the Phi-4 open-source model’s 2024 release. These are tailored for low-computing environments and device applications. Meanwhile, other companies and research teams are also entering the small models competition.
04
Mar
Kaynes Technology eyes acquisitions in Japan, Taiwan to strengthen EMS business
Kaynes Technology, a leading Indian electronics manufacturing services (EMS) provider, is planning strategic acquisitions in Japan and Taiwan to expand its global footprint and enhance manufacturing capabilities.
04
Mar
Chinese smartphone market shipments soar in 4Q24 before slip in 1Q25, says DIGITIMES
Smartphone shipments in the Chinese market reached slightly less than 79 million units in the fourth quarter of 2024, representing a 14.9% increase quarter-over-quarter and a 0.6% growth year-over-year. Looking ahead to the first quarter of 2025, it is estimated that shipment volumes will experience a single-digit decline, according to DIGITIMES’ latest report covering the Chinese smartphone market.
04
Mar
Lens Tech expands in automotive glass as EV growth offsets smartphone slowdown
Lens Technology is expanding beyond smartphones, strengthening its position in automotive glass manufacturing. While still a key Apple supplier, the company is accelerating its shift into new-energy vehicle (NEV) components, positioning itself for long-term growth despite short-term market headwinds.
03
Mar
Qualcomm Snapdragon X2 specs leak: up to 18 Oryon V3 cores expected
Qualcomm’s next-generation Snapdragon X2 processor, codenamed “Project Glymur,” is reportedly in development for Windows PCs. The chip is expected to feature up to 18 third-generation Oryon cores—a 50% increase over the previous generation’s 12-core design.
03
Mar
Compal raises capex to NT$10 billion in 2025
Taiwanese ODM Compal Electronics has raised its capital expenditure to NT$10 billion (US$304.83 million) in 2025, up from NT$7 billion in 2024. The additional funds will primarily be invested in servers and establishing factories overseas.