Rohm outsources back-end processes to India’s Suchi Semicon

Rohm and Suchi Semicon have announced a strategic manufacturing partnership intended to strengthen semiconductor production capacity in India and support both domestic and international markets. The collaboration pairs Rohm’s expertise in device technology and its global semiconductor presence with Suchi Semicon’s back-end manufacturing capabilities and operational experience to create a reliable, scalable manufacturing framework responsive to changing industry requirements.

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Escalation in the Middle East spotlights communication resilience ahead of 2026 UK Space‑Comm Expo

Recent joint airstrikes by the US and Israel against Iran, followed by Iran’s retaliatory attacks on nearby US military bases in Bahrain and Qatar, disrupted local flight schedules and communications, bringing “communication resilience” back into international focus and elevating the 2026 UK Space‑Comm Expo as a barometer for satellite backup technologies.

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Former TSMC executive under investigation for leaking core chip technology

Wei-Jen Lo, former senior vice president of corporate strategy development at TSMC, retired in 2025 and subsequently accepted an invitation from Intel to serve as executive vice president. Judicial authorities have officially launched an investigation and completed evidence collection regarding allegations that Lo leaked sensitive information. Cheng-Wen Wu, Minister of the National Science and Technology Council (NSTC), stated that after the incident, prosecutors consulted the Hsinchu Science Park Bureau to help verify that the sub-2nm process technology taken by Lo constitutes a national core key technology.

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