02
Mar
AMD is stepping up efforts to expand its position in the artificial intelligence semiconductor market, combining long-term customer agreements with equity-linked incentives as it seeks to narrow the gap with rival Nvidia.
02
Mar
Huawei takes 8,192-chip Atlas 950 global, escalates AI data center fight with Nvidia
Huawei has unveiled its Atlas 950 SuperPoD at Mobile World Congress (MWC) 2026 in Barcelona, marking the first overseas showcase of its most advanced AI supercomputer and positioning it directly against Nvidia’s AI data center systems.
02
Mar
Europe’s battery industry faces strategic setback as high costs and technology gaps cede ground to Asian rivals
Europe’s domestic battery sector is in a structural crisis, with high costs, technological shortfalls, and project delays eroding its ability to compete with Asian manufacturers.
02
Mar
Hyundai European hubs gain value as EU plans 70% local EV production rule
The EU is preparing to tighten electric vehicle subsidy rules by requiring that 70% of automotive components — excluding batteries — be produced within the bloc. The proposed measure is part of a broader policy shift aimed at strengthening domestic supply chains and reducing reliance on external manufacturing, particularly as competition intensifies in the global EV market.
02
Mar
Hiwin local production positioned as key supplier for South Korea semiconductor and AI-driven equipment upgrades
Hiwin Technologies has spent more than a decade building direct manufacturing and service capacity in South Korea, evolving from component sales to integrated mechatronic solutions and becoming a preferred supplier as semiconductor upgrades and AI-related investment accelerate.
02
Mar
Rapidus raises US$1.7 billion to support 2nm mass production by 2027
Japan’s state-backed chip venture Rapidus announced on February 27 that it has secured a total of JPY267.6 billion (about US$1.7 billion) in new funding from both government and private-sector investors, marking a key step in its push to mass-produce 2nm logic chips by 2027.
02
Mar
India roundup: An emerging chip trio in Asia
A trilateral semiconductor model is emerging, combining Japan’s capital, Taiwan’s ecosystem expertise, and India’s talent. Alongside this, companies including Foxconn, Polymatech Electronics, Nvidia, AMD, Kaynes Semicon, and IBM are deepening India investments, reflecting rising localization, supply-chain ambitions, and expanding AI, packaging, and materials ecosystems despite policy and trade uncertainties.
02
Mar
Insight: Memory shortage tightens grip on smartphone market as prices near tipping point
The memory market is no longer just a component story — it is becoming a fault line running through the entire tech industry. As AI infrastructure buildout accelerates, cloud and data-center operators are consuming DRAM and NAND at a pace that is crowding out smartphone makers, distorting foundry economics, and forcing chipmakers to rethink how they secure supply. The consequences are rippling from factory floors in Asia to boardrooms in Silicon Valley.
02
Mar
Google brings Intrinsic in-house to accelerate physical AI development
Google has announced that robotics software company Intrinsic will join its operations as a distinct unit within the company, a move aimed at accelerating the deployment of artificial intelligence in physical systems such as industrial robotics. The integration reflects Google’s effort to extend AI beyond digital applications into real-world environments and scale practical physical automation solutions.
02
Mar
Nvidia’s Vera Rubin platform faces HBM4, cooling, and software hurdles ahead of ramp
Nvidia’s next-generation Vera Rubin platform has moved from public unveiling to early customer sampling, with the company projecting a broader production ramp later this year. Both the company and its partners, however, face a complex array of engineering, supply-chain, and data center infrastructure challenges before Rubin can displace prior architectures as the industry standard for large-scale artificial intelligence.