22
Jan
GlobalWafers chairman Doris Hsu told the media on January 21, 2026, that the company’s global expansion plans are starting to pay off, with subsidiaries in Niigata and Utsunomiya, Japan, as well as Denmark, all hitting record revenues in 2025. Niche products like gallium nitride (GaN) stood out for their strong performance. Hsu also outlined GlobalWafers’ 2026 strategy and shared her outlook on market conditions.
22
Jan
Chinese AI chipmakers face mixed reactions to Nvidia H200 block
The US has confirmed that under a new set of stringent regulations, Nvidia’s H200 is permitted to be exported to the Chinese market, and Chinese customers have expressed strong demand. However, the Chinese government has shown no intention of granting approval, causing supply chain plans that were originally preparing to ship to be put on hold. Currently, the main obstacle to entering the Chinese market is the mindset of the Chinese authorities. From the Chinese government’s perspective, since domestic AI chips are already usable, there is no need to further allow China’s AI development to rely more heavily on the US and Nvidia.
22
Jan
Mercedes-Benz scales back L3 autonomy as AI reshapes the auto industry
Despite the debut of the Alpamayo self-driving AI architecture by Nvidia at CES 2026, Mercedes-Benz, the earliest adoptor of the architecture, instead turned to focus on enhanced Level 2 systems (L2+) with the removal of the L3 autonomous driving functionalities in the refreshed version of its flagship S-Class in late January.
22
Jan
EMS watch: Celestica and Flex double down on platform-led data center builds; Sanmina and Jabil expand through M&A and diversified portfolios
Electronics manufacturing services (EMS) providers are sharpening their competitive positions around AI-era infrastructure, shifting attention from cyclical end markets to longer-cycle platform builds for cloud, networking, and data centers. Recent company updates from Celestica, Sanmina, Jabil, and Flex show a common playbook: move up the value chain, standardize repeatable system designs, and invest in power, thermal, and integration capabilities that shorten deployment times for hyperscale customers.
22
Jan
EMS watch: Chinese EMS champions reshape their playbooks around AI hardware, autos, and global delivery
A cluster of China’s leading electronics manufacturers and component suppliers is entering the new year with a clearer division of labor across the AI device wave, automotive electrification, and globalized manufacturing. Recent company filings, investor communications, and post‑autumn analyst commentary point to a common theme: growth is being pursued less through single-product cycles and more through platform capabilities—vertical integration, module-level design, and cross‑sector customer expansion—while capital market actions and overseas footprints are being positioned as strategic amplifiers.
22
Jan
AOC Q27G4ZDP/WS debuts with a 4th Gen WOLED display
21
Jan
Sony transfers 51% of its TV business to TCL, will form a JV that will operate from April 2027
21
Jan
Asus launches Mac-friendly features for its ProArt Displays
21
Jan
The Asus PA32KCX 8K ProArt monitor is finally available for purchase
21
Jan
Research Insight: High-end fiberglass cloth supply tightens as server demand spotlights Nittobo
As next-generation AI server platforms enter volume deployment, supply chain constraints are extending beyond high-bandwidth memory (HBM). Bottlenecks are increasingly emerging in printed circuit boards (PCBs) and critical upstream materials, according to DIGITIMES analysis.