Samsung Electronics is encountering significant challenges, especially in its semiconductor business. Beyond stagnation in its foundry business, concerns about its competitiveness in high bandwidth memory (HBM) have surfaced. Industry sources suggest that Samsung may redesign part of the 1a DRAM circuitry to enhance its HBM competitiveness.

The US Department of Commerce has partnered with Infinera through the CHIPS and Science Act, signing a non-binding memorandum to provide up to US$93 million in funding. This investment aims to boost Infinera’s semiconductor manufacturing and advanced packaging operations in California and Pennsylvania. The initiative, focused on national security and enhancing communications infrastructure, seeks to create new jobs while fortifying the US supply chain, supporting long-term economic resilience and growth.

ASML’s late-night financial report landed like a “depth charge” in the semiconductor industry, exposing the fragility of the AI-driven demand surge. Orders from China, which had bolstered sales in recent years, have plummeted sharply.