Taiwan’s Wonderful Hi Tech projects double-digit growth in 2026 on AI and satellite demand

Global high-performance transmission cable maker Wonderful Hi Tech offered an optimistic outlook at its investor briefing on November 18, 2025. Despite a slight year-over-year revenue decline in the third quarter of 2025—attributed to the end of pre-stockpiling by clients ahead of tariff changes—company executives said the inventory adjustment is expected to conclude by year-end, setting the stage for a robust start to 2026. With continued growth in AI and low-Earth-orbit (LEO) satellite markets, the company anticipates 2026 will be a high-growth year.

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MediaTek expands automotive chip business with Denso partnership

MediaTek has announced a collaboration with Japanese automotive giant Denso to jointly develop customized SoC products for advanced driver-assistance systems (ADAS) and smart cockpit technologies. By combining Denso’s expertise in automotive safety standards with MediaTek’s chip development experience and IP portfolio, the partners aim to rapidly create and mass-produce solutions tailored to automakers’ specific needs.

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8-inch foundry price rises take hold as BCD, HV nodes lead

The global 8-inch wafer foundry market has entered a price upcycle. Foundries, including SMIC and Hua Hong Semiconductor, along with major Taiwanese and South Korean mature-node players, have notified customers that 8-inch foundry prices are set to rise by around 5 to 10% starting in the first quarter of 2026, covering specialty processes such as BCD and high-voltage (HV) platforms.

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Huawei launches global prize to break memory bottlenecks

As generative AI and large language models scale rapidly, the computing race is shifting toward a quieter but decisive battleground: how data is stored, accessed, and utilized. According to Sina and Securities Times, Huawei has launched a global call for solutions through the sixth OlympusMons Awards, which opened on December 26, 2025. With a total prize pool of CNY3 million (US$426,000), the program seeks innovations aimed at overcoming storage and memory bottlenecks in the AI era.

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