U.S. government announces up to $300 million in funding to boost advanced semiconductor packaging

The U.S. government announced plans to invest up to $300 million in three advanced semiconductor packaging research projects located in Georgia, California, and Arizona. These projects aim to develop cutting-edge technologies in advanced substrates, a critical component in the semiconductor supply chain that supports industries like artificial intelligence (AI), next-generation wireless communication, and energy-efficient electronics.

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Finesse Technology rides TSMC, Applied Materials wave: Expansion to Kumamoto with optimistic outlook

Finesse Technology, a subsidiary of Highlight Technology Corp, specializes in semiconductor ozone supply systems, remote plasma sources (RPS), RF power systems, and technical maintenance services. These solutions are integral to critical semiconductor manufacturing processes, including chemical vapor deposition (CVD) and atomic layer deposition (ALD).

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Xi highlights AI risks, warns against US-China decoupling

At the 2024 World Internet Conference (WIC), Chinese President Xi Jinping emphasized that while AI empowers humanity to better understand and reshape the world, it also presents unpredictable risks and challenges. Xi urged the global community to adopt security as a core principle and collaborate to establish a “shared future in cyberspace,” according to the South China Morning Post.

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MLCC firm Holy Stone to see stable growth in 2025 automotive orders

Niche multi-layer ceramic capacitor firm Holy Stone Enterprise points to uncertain demand in the industrial control market for 2025, in contrast with the automotive sector, which will see clear demand next year, even though inventory checks have continued into the fourth quarter of 2024. In addition, power supply-related demand for AI servers is expected to grow as well.

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