As artificial intelligence (AI) strains data center cooling limits, a seismic shift from traditional air systems to liquid cooling solutions is reshaping the US$5 billion thermal management market, industry analysts say.
According to ET News, SK Hynix is setting its sights on the semiconductor packaging market by offering packaging foundry services, a move that analysts say capitalizes on its expertise in high bandwidth memory (HBM).
Following Huawei’s recent advancements, TCL, a leading Chinese home appliance brand, has revealed its dual-folding technology, signaling potential plans for a tri-fold smartphone. This move has sparked industry speculation on whether Samsung Electronics will join the competition in the tri-fold smartphone segment.