Cooling module manufacturer Microloops announced plans to expand its liquid cooling plate production capacity in Vietnam and China to address growing demand for liquid cooling solutions. Currently, Microloops’ monthly liquid cooling plate output in China stands at 5,000 units, but by 2026, combined capacity across both locations is expected to reach 40,000 units, reflecting the rapid adoption of server liquid cooling technology.

The US House Committee on Foreign Affairs passed the Chip Security Act, signaling a decisive move to restrict high-performance computing exports amid rising tech tensions with China. Meanwhile, reports from within China indicate a growing consensus to halt imports of US-origin AI chips altogether.

Samsung Electronics has reportedly begun mass production of 236-layer NAND flash at its Xi’an plant in China, marking a key step in its transition to higher-layer memory as demand from artificial intelligence applications accelerates.

The global semiconductor industry is undergoing a structural transformation. SEMI estimates that in 2025, capital expenditures (CapEx) by the four largest US cloud service providers (CSPs) will reach US$400 billion, more than twice the total semiconductor industry CapEx. When including Chinese cloud providers and sovereign AI investments, global AI infrastructure spending could surpass US$1 trillion by 2027.