华为新智能手表通过认证：配无线充电底座，有望为GT系列产品
7 月 23 日消息，型号为 VLI-B29、VLI-B19 的华为新手表通过国内 CQC 认证，配充电底座，支持 18W 充电。
23
Jul
23
Jul
23
Jul
机构：预计三季度智能手机面板整体价格仍将呈现稳中有降的趋势
7月23日消息，群智咨询报告指出，进入三季度，随着为下半年新机发布备货做准备，智能手机面板整体需求有所提高，但各技术别之间仍有差异，低端市场及高端旗舰机型备货仍相对比较积极，但中端机型市场备货需求相对较弱。
22
Jul
Global IT outage hits Microsoft cloud, automotive industry faces disruptions
Microsoft faced a significant disruption in its cloud services on July 19, leading to temporary system outages in major organizations around the world. In a statement, the company attributed the incident to a software update from cybersecurity firm CrowdStrike, which affected 8.5 million Windows devices, representing less than 1% of the total.
22
Jul
VW, Xpeng deepen software collaboration across EVs in China
Xpeng Inc. will deepen its cooperation with Volkswagen AG, with the two pledging to develop a new electrical and electronic solution for all battery-powered cars made in China under the VW brand.
22
Jul
OpenAI releases GPT-4o mini, a cheaper version of flagship AI Model
OpenAI is rolling out a more affordable, slimmed-down version of its flagship artificial intelligence model to appeal to a wider range of developers and business customers in an increasingly crowded market for AI services.
22
Jul
Advantest Taiwan opens new HQ amid surging AI chip demand
Advantest Taiwan recently opened its new headquarters at the Tai Yuen Hi-Tech Industrial Park in Chubei, northern Taiwan. According to Alex Wu, president and CEO of Advantest Taiwan, staff began relocation in June.
22
Jul
Taiwan prioritizes drones and AI in new defense technology unit
Taiwan has established a new Defense Innovation Unit (DIU) to accelerate the integration of drones and Artificial Intelligence (AI) systems into its military strategy. This unit, modeled after the US DIU, will bridge the gap between civilian technological advancements and their applications in the defense sector.
22
Jul
AI PCs generate buzz but face supply chain skepticism over replacement wave
AI PCs are generating considerable buzz, but its supply chain remains skeptical about their potential to spark a widespread replacement cycle. The primary obstacles are the steep prices of AI PCs and the absence of a killer application. It’s more likely that incremental upgrades will boost AI PC adoption rather than consumers rushing to replace their existing devices.
22
Jul
FOPLP under advanced packaging spotlight after CoWoS
Demands for advanced packaging services have surged as every smartphone is expected to be equipped with generative AI applications in the future. Taiwan Semiconductor Manufacturing Company (TSMC) chairman C.C. Wei emphasized in a recent earnings conference that AI chips have kept its Chip-on-Wafer-on-Substrate (CoWoS) production line busy, repeatedly stating that capacities remain tight despite doubling production lines.