U.S. government announces up to $300 million in funding to boost advanced semiconductor packaging

The U.S. government announced plans to invest up to $300 million in three advanced semiconductor packaging research projects located in Georgia, California, and Arizona. These projects aim to develop cutting-edge technologies in advanced substrates, a critical component in the semiconductor supply chain that supports industries like artificial intelligence (AI), next-generation wireless communication, and energy-efficient electronics.

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Finesse Technology rides TSMC, Applied Materials wave: Expansion to Kumamoto with optimistic outlook

Finesse Technology, a subsidiary of Highlight Technology Corp, specializes in semiconductor ozone supply systems, remote plasma sources (RPS), RF power systems, and technical maintenance services. These solutions are integral to critical semiconductor manufacturing processes, including chemical vapor deposition (CVD) and atomic layer deposition (ALD).

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