Hygon outlines dual-chip roadmap for system-level AI computing
At the Hygon-initiated HAIC 2025 Artificial Intelligence Innovation Conference in Kunshan from December 17 to 19, Hygon Information Technology unveiled a “dual-chip strategy,” positioning its DCU accelerator and CPU as a tightly integrated foundation for China’s next phase of AI infrastructure.
AI drives high-speed optics shift as LuxNet, TrueLight scale 800G and CW lasers by 2026
Whetron gears up for IPO with integrated ADAS strategy
Taiwan’s energy transition at risk as solar grid connections see historic low, foreign divestment
YF Capital backs InnoStar Semiconductor, extending Jack Ma’s China memory chip push
Yao Sheng lands US drone PCBA order as diversification gains momentum
China surges ahead of US in drone patents, heightening pressure on Taiwan
China has maintained a clear lead over the US in drone-related technology patents since 2016, highlighting a widening technology gap as Taiwan seeks to expand its domestic drone industry and reduce reliance on China-centric supply chains. The divergence underscores the scale of the challenge facing Taiwan at a time when governments worldwide are accelerating procurement of unmanned systems and reassessing supply chain security.