TSMC’s three-pronged strategy: Outsourcing CoWoS to Amkor as US plant exceeds expectations

TSMC has taken the unusual step of opening up its Chip-on-Wafer-on-Substrate (CoWoS) outsourcing opportunities and recently announced a memorandum of understanding (MOU) with Amkor. TSMC’s front-end wafer fabrication plant in Arizona will closely collaborate with Amkor’s back-end packaging and testing facility to streamline the product manufacturing cycle.

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Samsung’s HBM3E reportedly clears Nvidia’s on-site inspection; mass production still pending

Samsung Electronics and Nvidia have reportedly completed the on-site inspection of the fifth-generation high bandwidth memory (HBM3E). Despite delays in mass production and supply, earlier issues related to power consumption and thermal performance have been resolved. This progress strengthens Samsung’s position in the competitive memory market, though ongoing developments in its collaboration with Nvidia, especially in light of competition from SK Hynix, remain worth watching.

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Qualcomm accelerates 4G IoT technology acquisition plans as part of its diversification efforts

Qualcomm has completed a US$200 million acquisition of Sequans Communications’ 4G IoT technology assets, marking a significant step in the company’s diversification strategy. This move comes as Qualcomm’s mobile business experiences a slowdown in growth, prompting the company to expand into other sectors in recent years. The acquisition is expected to substantially enhance Qualcomm’s semiconductor product portfolio in the IoT space.

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Avnet to elevate Chinese chips onto global stage

With the rise of Chinese chip manufacturers in recent years, local customer development and technical support have become key factors in their globalization efforts. Hua Dong, president of Avnet China, stated that through the local workforce deployment of international IC distributors in overseas markets, existing business networks can quickly assist Chinese chip manufacturers.

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China’s restrictions on Nvidia chips drag Samsung’s HBM into muddy water

Reports suggest that the Chinese government is discouraging local companies from purchasing Nvidia’s AI chips, which may affect Samsung Electronics’ High Bandwidth Memory (HBM) sales. Newsis reported that Samsung is currently supplying HBM for Nvidia’s H20 custom chips for China. This marks the first instance of Samsung’s HBM3 being used in Nvidia’s chips. If the Chinese government implements a ban, the impact on Samsung could be significant.

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Sansui S55VOUG – a 55″ 120Hz 4K OLED TV priced at USD 800

Sansui S55VOUG is a brand-new affordable OLED TV priced at just USD 800. It can be purchased in the U.S. via Amazon.com, Walmart.com, Micro Center, BJ’s Wholesale Club, and BrandsMart. The TV is in the 55″ size class and features a 4K OLED display panel with a 120Hz refresh rate. It delivers a typical brightness of 500 nits and supports HDR10 and MEMC. The audio department has a 2.1CH speaker…

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