*ST合泰：预计2024年半年度亏损9.9亿~7.9亿
7月10日，*ST合泰（002217）发布半年度业绩预告，公司预计2024年1-6月预计减亏，归属于上市公司股东的净利润为-9.90亿至-7.90亿，净利润同比增长57.91%至66.41%，预计基本每股收益为-0.3177至-0.2535元。
10
Jul
10
Jul
维信诺：预计2024年上半年亏损11亿元-14.5亿元
维信诺（002387）7月9日晚间披露业绩预告，预计2024年上半年实现营业收入38亿元至41亿元，同比增长41.1%-52.24%；归母净利润亏损11亿元至14.5亿元，上年同期亏损16.34亿元；扣非净利润亏损11.4亿元至14.9亿元，上年同期亏损16.56亿元；基本每股收益-0.79元/股至-1.05元/股。
10
Jul
杉杉股份：上半年净利预降超九成
7月9日晚间，杉杉股份（600884）披露公告称，公司预计2024年半年度实现归属净利润约为1500万元到2250万元，与上年同期（法定披露数据）相比，将减少约9.91亿元到9.98亿元，同比减少97.78%到98.52%。
10
Jul
华映科技：上半年预亏5.54亿元-5.74亿元
7月9日，华映科技(000536.SZ)公布2024年半年度业绩预告，经财务部门初步测算，预计2024年半年度实现归属于上市公司股东的净亏损5.54亿元-5.74亿元，比上年同期增长21.00%–23.75%
09
Jul
Beijing legislates for robotaxis as backlash against them climbs
Beijing will support the introduction of robotaxis in ride-hailing and car rental fleets in the city as advanced driver assistance systems become more commonplace in China.
09
Jul
Honda to consolidate Thai car plants amid electrification push
Honda Motor Co. will consolidate its two car plants in Thailand by 2025 to deal with overcapacity and focus resources on electrification as battery electric vehicles gain popularity in the Southeast Asian nation with Chinese automakers entering the market.
09
Jul
Texas bolsters Indo-Pacific semiconductor ties with US1.4 billion incentives
Texas Governor Greg Abbott is visiting Taiwan to strengthen bilateral ties in critical industries and attract semiconductor companies to set up plants in his state.
09
Jul
Arm focusing on four major AI applications, but competition from in-house developed ICs rising, says DIGITIMES Research
In the keynote speech at Computex 2024, Arm revealed its focus on four major AI application areas: mobile phones, PCs, automobiles, and the cloud.
09
Jul
Resonac forms alliance developing advanced packaging in US
A new semiconductor back-end process R&D alliance, US-JOINT, is set to launch in Silicon Valley in 2025. The alliance will focus on next-generation semiconductor packaging technologies to verify the latest concepts and innovations in the field.
09
Jul
Samsung to make 2nm chips for Japan AI firm
Samsung Electronics has announced that it will provide turnkey semiconductor solutions using the 2-nanometer (nm) foundry process and the advanced 2.5D packaging technology Interposer-Cube S (I-Cube S) to Preferred Networks, a leading Japanese AI company.