The world’s first 240Hz RGB stripe OLED panel will debut at CES 2026

LG Display announced today that it will unveil the world’s first 27‑inch 4K RGB stripe OLED panel with a 240Hz refresh rate at CES 2026, the global technology trade show set for January. The company said the new panel combines the color precision of an RGB stripe layout with performance levels previously unseen in stripe‑pattern OLEDs, positioning the product for both high‑end gaming and…

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2D materials: from memory entry to logic’s future

Two-dimensional (2D) materials were once regarded as important candidates for extending semiconductor scaling. Because they are only an atom thick, they are theoretically very suitable for fabricating extremely small, ultra-low-power transistors. However, once these ideas move into advanced logic processes, challenges begin to surface. The problem lies in the fact that using 2D materials to fabricate FETs requires process control that is nearly at the single-atom level.

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Samsung’s ‘Wide Fold’ sets up a 4:3 foldable showdown with Apple in 2026

Samsung Electronics is preparing to escalate the foldable smartphone race. Industry sources say the company plans to launch a new foldable handset, internally dubbed “Wide Fold,” in autumn 2026, positioning it directly against Apple’s long-anticipated foldable iPhone. If timelines hold, the two products will debut within the same launch window, setting up a rare head-to-head between the world’s two largest smartphone vendors.

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Taiwan advances ‘dream memory’ R&D beyond DRAM for AI era

Once a low-cost commodity underpinning global computing, dynamic random-access memory (DRAM) has become a strategic chokepoint as AI-driven demand reshapes supply chains. With prices rising and conventional scaling nearing its limits, Taiwanese researchers—backed by government funding—are racing to develop next-generation memory technologies that promise higher density, lower power consumption, and resilience in extreme environments.

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CHIPX eyes Malaysia for 8-inch GaN-on-SiC wafer fab

Dublin-based semiconductor startup CHIPX plans to build an 8-inch gallium nitride on silicon carbide wafer fabrication plant in Malaysia to meet rising demand from artificial intelligence (AI) data centers and high-voltage power electronics, CEO and founder Chinmoy Baruah told DIGITIMES Asia. The project aims to establish a front-end manufacturing presence in Southeast Asia, with the company expecting to reach key milestones beginning in January 2026.

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PQC security chips likely to adopt plug-in deployment for data protection

As cybercriminals gain access to increasingly more computing power capable of breaking existing encryption algorithms in seconds, the standard for cybersecurity has shifted. It is no longer measured by how long it can hold but by ensuring attackers gain absolutely nothing. Post-quantum cryptography (PQC) security chips will therefore adopt a scorched-earth policy to guarantee that critical data cannot be accessed.

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