24
Dec
24
Dec
2D materials: from memory entry to logic’s future
Two-dimensional (2D) materials were once regarded as important candidates for extending semiconductor scaling. Because they are only an atom thick, they are theoretically very suitable for fabricating extremely small, ultra-low-power transistors. However, once these ideas move into advanced logic processes, challenges begin to surface. The problem lies in the fact that using 2D materials to fabricate FETs requires process control that is nearly at the single-atom level.
24
Dec
Samsung’s ‘Wide Fold’ sets up a 4:3 foldable showdown with Apple in 2026
Samsung Electronics is preparing to escalate the foldable smartphone race. Industry sources say the company plans to launch a new foldable handset, internally dubbed “Wide Fold,” in autumn 2026, positioning it directly against Apple’s long-anticipated foldable iPhone. If timelines hold, the two products will debut within the same launch window, setting up a rare head-to-head between the world’s two largest smartphone vendors.
24
Dec
Taiwan advances ‘dream memory’ R&D beyond DRAM for AI era
Once a low-cost commodity underpinning global computing, dynamic random-access memory (DRAM) has become a strategic chokepoint as AI-driven demand reshapes supply chains. With prices rising and conventional scaling nearing its limits, Taiwanese researchers—backed by government funding—are racing to develop next-generation memory technologies that promise higher density, lower power consumption, and resilience in extreme environments.
24
Dec
Moore Threads challenges Nvidia as S5000 targets Hopper-class LLM training
Just 15 days after listing, China-based AI chip maker Moore Threads moved quickly to signal confidence. At a new-generation chip launch, founder and CEO James Zhang said companies training large language models on Nvidia’s Hopper GPUs could achieve better results by switching to Moore Threads’ S5000 platform.
24
Dec
CHIPX eyes Malaysia for 8-inch GaN-on-SiC wafer fab
Dublin-based semiconductor startup CHIPX plans to build an 8-inch gallium nitride on silicon carbide wafer fabrication plant in Malaysia to meet rising demand from artificial intelligence (AI) data centers and high-voltage power electronics, CEO and founder Chinmoy Baruah told DIGITIMES Asia. The project aims to establish a front-end manufacturing presence in Southeast Asia, with the company expecting to reach key milestones beginning in January 2026.
24
Dec
EVs and chips convergence: Taiwan’s auto industry shifts south
Beyond the traditional auto-related businesses that have long been rooted in southern Taiwan, a broader shift has taken shape in recent years. From manufacturing to retail, industry activity has increasingly gravitated toward the island’s south, reflecting bigger changes in how cars are made, sold, and integrated with technology.
24
Dec
ENE Technology warns DDR shortage may hit revenue, eyes drones for growth
ENE Technology said persistent shortages of DDR memory could weigh on revenue over the next two quarters, as tight supplies of DRAM and storage chips continue to pressure notebook and smartphone markets heading into 2026.
24
Dec
PQC security chips likely to adopt plug-in deployment for data protection
As cybercriminals gain access to increasingly more computing power capable of breaking existing encryption algorithms in seconds, the standard for cybersecurity has shifted. It is no longer measured by how long it can hold but by ensuring attackers gain absolutely nothing. Post-quantum cryptography (PQC) security chips will therefore adopt a scorched-earth policy to guarantee that critical data cannot be accessed.
24
Dec
Quantum reshapes cybersecurity as AI and industrial sectors deploy PQC
Traditional encryption systems are facing challenges as AI and quantum computing advance. In early 2025, international financial institutions and automotive supply chains began adopting post-quantum cryptography (PQC) to prepare for potential threats posed by quantum computers. Now, AI data centers and industrial applications are also integrating PQC.