The semiconductor industry is experiencing a surge in demand for advanced packaging technologies, driven by the rapid growth of high-end AI servers and generative AI. This trend has led to a shortage in Chip-on-Wafer-on-Substrate (CoWoS) technology, a critical component in advanced packaging. Manz AG, a major equipment manufacturer, remains optimistic about the future of advanced packaging and is positioning itself to capitalize on emerging trends.

据央广网，近日，位于苏州市相城区黄埭镇的苏州天禄光科技股份有限公司新建光学板材生产线项目主体结构封顶。该项目是苏州市级重点项目。

据日经新闻8月27日报导，因以中国为中心、电视销售不振，库存增加的电视厂商抑制采购，导致电视用液晶面板市况恶化，指标性产品价格今年来(2023年12月以来)首降。电视用液晶面板价格为亚洲面板厂和客户(电视厂)每个月敲定一次。