SK Hynix diversifies supply chain, challenges Hanmi’s grip on HBM equipment

SK Hynix is set to diversify its supply chain for thermocompression bonding (TCB) equipment used in HBM manufacturing. The company acquired an order of 30 units of TCB machines from ASM Pacific Technology (ASMPT) in September 2024, South Korean media outlet TheElec reports. This move aims to reduce the firm’s dependence on Hanmi Semiconductor while ramping up its production of 12-layer HBM3E products.

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Liteon eyes 20% automotive revenue share with innovative solutions amid market upswing

Global car sales are projected to grow slightly to around 90 million units in 2024, a modest increase that remains significant for supply chain players, according to Liteon Technology president Anson Chiu. He emphasized that there is no need for concern regarding overall market performance, as the company anticipates its revenue share from automotive electronics will surge to 15-20% in the future, driven by rising demand for high-value products.

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