Apple Inc. will open its first retail location in Malaysia next month as it expands its presence in Southeast Asia to augment both sales and operations outside of China.
BYD Co. unveiled a new hybrid powertrain capable of traveling more than 2,000 kilometers (1,250 miles) without recharging or refueling, intensifying the EV transition war against Toyota Motor Corp. and Volkswagen AG.
Nvidia is reportedly planning to adopt Fan-Out Panel Level Packaging (FOPLP) technology for its GB200 AI server chips ahead of schedule, aimed at addressing the tight production capacity of Chip on Wafer on Substrate (CoWoS) packaging at TSMC.
Microcontroller manufacturer Nuvoton Technology held its shareholders’ meeting on May 28. The company reported that the PC market performed better than initially expected, and MCU orders are gradually returning.