China’s domestic AI chipmakers are making fast progress in closing the gap on international leaders, according to SenseTime Group Inc. co-founder Xu Bing.
Chinese CPU maker Loongson Technology Founder and Chairman Hu Weiwu, who is also a Chinese Academy of Sciences Institute of Computing Technology researcher, told Xinhua News Agency that Loonson’s next-generation CPU will match the performance of Intel’s 12th-generation Core i5.
Samsung Electronics is keenly exploring “hafnia ferroelectrics” as a next-generation NAND flash material, with the hope that this new material will enable stacking over 1,000 layers of 3D NAND and achieving petabyte-level SSDs.
South Korean media outlets Money Today and Yonhap News reported that the Industrial Technology Security Investigation Team of the South Gyeonggi Provincial Police Agency arrested a former SK Hynix employee in her 30s, a Chinese national, in April 2024 on suspicion of violating the Industrial Technology Leakage Prevention and Protection Act. The prosecution initiated the indictment process in early May.
Recently, analysis within South Korea’s securities industry suggests that Samsung Electronics may secure orders for 3nm chips from AMD. Apart from factoring in TSMC’s production capacity, hints from AMD’s presentation at the ITF World 2024 event also provide clues.
US chip giant Marvell Technology has opened a new office in Da Nang, central Vietnam, aiming to expand its operations and create a world-class IC design center.
As the spotlight on AI-powered PCs intensifies and market competition heats up, Lenovo Executive Vice President Luca Rossi reveals the company’s strategic move to offer differentiated products tailored for both Chinese and international markets. Rossi claims this will secure Lenovo a “unique position” in the burgeoning global AI PC arena.
Micron, which has a DRAM factory in Hiroshima Prefecture, Japan, is reportedly planning to construct a new plant adjacent to the existing Hiroshima factory as early as 2026.