xMEMS aims for 2025 production of groundbreaking cooling SoC with 3-pronged market entry strategy

US-based xMEMS Labs is set to deliver its newly unveiled XMC-2400 µCooling™, a single-chip (SoC) air-cooled all-silicon active cooling solution utilizing MEMS technology, to customers for validation in the first quarter of 2025 and begin commercial production by the end of next year. TSMC and Bosch are among the prospective foundry partners.

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Kenmec expects sales recovery in 2H24

Kenmec Mechanical Engineering saw lower-than-expected performance in the first half of 2024 due to fluctuations in the economy and construction delays, even though the company had already secured orders. However, in an August 21 statement, company CEO Frank Hsieh expects operations to return to normal in the second half of the year, making up for earlier delays.

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