BIS adds 22 Chinese entities among 37 to Entity List, highlighting quantum tech concerns

In a recent move aimed at bolstering national security measures, the US Commerce Department’s Bureau of Industry and Security (BIS) has added 37 entities to the Entity List under the Export Administration Regulations (EAR), including 22 from the People’s Republic of China (PRC). What is noteworthy is that quantum technology is specifically mentioned for adding the new Entity List.

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Rapidus gears up for advanced packaging and chiplet technologies as it races to 2nm production

Japan’s semiconductor foundry startup Rapidus, now on a mission to mass produce 2nm chips by 2027, is developing advanced packaging and chiplet technologies, with a particular focus on interposer technology crucial for connecting chips with substrates. However, Rapidus is also tackling the challenge of improving production yield to win more advanced-packaging customers.

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