At the 2024 North America Technology Symposium, TSMC demonstrated its latest semiconductor process, advanced packaging, and 3D IC technologies, which will drive the next wave of AI developments with silicon leadership.
Dutch equipment giant ASML recently announced its commitment to achieving “net-zero” emissions, including those from its customers, by 2040. This move is reshaping standards in the semiconductor industry, making RE100 not only a customer requirement but potentially influencing the procurement priority for advanced semiconductor equipment.
Apple is diversifying rather than expanding its supplier base in India, as indicated by its latest supplier list. Despite some concerns from the Indian government, China-based suppliers continue to play a significant role in Apple’s India strategy.
SK Hynix has announced plans to expand production capacity for next-generation DRAM, including HBM, a critical component of AI infrastructure. This decision is in response to the growing demand for AI chips.
As the US-China technology war enters its seventh year, with the process of domestic substitution policy of China’s semiconductor industry continuing to deepen, China’s local Electronic Design Automation (EDA) software products have made considerable progress in recent years and accelerated their development to bridge the 15 years gap with their American and European rivals.