京东方申请彩膜基板及其制作方法、掩膜版、显示面板及显示装置专利
6月4日消息，天眼查知识产权信息显示，京东方科技集团股份有限公司申请一项名为“彩膜基板及其制作方法、掩膜版、显示面板及显示装置“，公开号CN202410460684.7，申请日期为2024年4月。
04
Jun
04
Jun
消息称苹果iPhone16 Pro将成为全球最窄边框手机
6月4日消息，消息源@i冰宇宙昨日（6月3日）在X平台发布推文，曝料称苹果iPhone 16 Pro将收窄边框，超过三星Galaxy S24手机，成为全球边框最窄的手机。消息源并未提及苹果iPhone 16 Pro Max，预估苹果也会收窄该机型的边框。
04
Jun
预估至2028年折叠手机市场渗透率接近5%：三星、华为、小米……表现各异
6月4日消息，TrendForce集邦咨询3日发布报告称，折叠屏手机出货量预计在2024年达到1,780万台，仅占智能手机市场份额的1.5%，预估在2028年市场占有率将攀升至4.8%。
04
Jun
洛图科技：电子纸平板在2024年迎来彩色时代
但从趋势上来看，彩色屏产品的渗透正在逐年递增。2022年，彩色屏的占比仅为2.7%，2023年提升至了4.2%，2024年前四个月的表现翻倍为8.6%。
04
Jun
45亿元注册资本已全部到位 莱宝高科MED项目预计下半年开工
6月2日，莱宝高科公布了投资者关系活动记录表。在记录表中，莱宝高科透露，微腔电子纸显示器件（MED）项目45亿元人民币现金出资的注册资本已于2024年5月29日全部到位。预计今年下半年将正式开工建设。
03
Jun
China semiconductor players and techs
Despite the sanctions from the US, the Chinese government and semiconductor firms continued to step up their effort in promoting independent development of China’s semiconductor industry.
03
Jun
EV sales defy China spending slump as price cuts lure buyers
Electric vehicles remain a bright spot in China’s auto market as manufacturers of battery-powered cars overcame a slump in consumer spending at home thanks to price cuts and new model launches.
03
Jun
Microsoft makes US$3.2 billion AI bet on Swedish data centers
Microsoft Corp plans to invest $3.2 billion in artificial intelligence and cloud facilities in Sweden, its largest-ever infrastructure bet in the Nordic country drawing on the region’s rich supply of green energy.
03
Jun
SK Hynix races ahead in HBM with next-gen innovation
SK Hynix is swiftly advancing in the High-Bandwidth Memory (HBM) arena, aiming to develop next-generation HBM that incorporates computing, communication, and other advanced functions. This strategic move is designed to leverage differentiated technologies, further extending its lead over competitors.
03
Jun
AMD working with TSMC on 3nm chips, says Su
AMD has a close and solid relationship with TSMC on the 3nm technology, and the two companies are already working on several new product developments, according to Lisa Su, chairperson and CEO for the processor vendor.