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30 May
Latest News and Trends

Samsung boosts workforce at Japan R&D lab to drive chips packaging innovations

  • May 30, 2024
  • By author-avatar jeff
Samsung Electronics has recently expanded its workforce deployment at its new packaging R&D base in Yokohama, Japan, to expedite construction and support the development of next-generation semiconductor packaging technologies.

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30 May
Latest News and Trends

Sony adjusts CIS production expansion schedule; equipment investment reduced for next three years

  • May 30, 2024
  • By author-avatar jeff
Sony’s semiconductor business division, primarily focused on CMOS Image Sensors (CIS), plans to reduce its equipment investment amount in the next three fiscal years from 2024 to 2026 (April 2024 to March 2027) by about 30% compared to the previous three-year mid-term plan.

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30 May
Latest News and Trends

Automotive LED supplier Brightek sees rebounding orders from Chinese NEV market

  • May 30, 2024
  • By author-avatar jeff
As China’s automotive market plunges into intense internal price competition, Brightek Optoelectronic Co. focuses on automotive LED products as the main driver of its operational growth.

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30 May
Latest News and Trends

Himax announces strategic investment in Obsidian Sensors

  • May 30, 2024
  • By author-avatar jeff
Himax Technologies has made a strategic investment in Obsidian Sensors, a thermal imaging sensor maker based in San Diego, according to the Taiwan-based IC design house.

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30 May
Latest News and Trends

Following in BOE’s footsteps, Visionox announces 8.6-gen OLED investment

  • May 30, 2024
  • By author-avatar jeff
China’s panel industry is accelerating its venture into the IT OLED market.

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30 May
Latest News and Trends

India reportedly plans to implement import quota for notebooks in October

  • May 30, 2024
  • By author-avatar jeff
India introduced an import management system for imported notebooks and tablets, which displeased major exporters.

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30 May
Latest News and Trends

Low birth rate crisis: government moves to attract foreign talent

  • May 30, 2024
  • By author-avatar jeff
Taiwan’s demographic challenge is intensifying as the nation grapples with a declining birth rate. In response, the government is amending laws to expand the recruitment and retention of overseas Chinese and foreign students to alleviate the anticipated economic impact.

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30 May
Latest News and Trends

Strong AI momentum expected to drive passive component demand

  • May 30, 2024
  • By author-avatar jeff
As demand for AI servers steadily grows, it directly drives the need for passive components.

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30 May
Latest News and Trends

China mulling CNY6 billion to boost all-solid-state battery R&D

  • May 30, 2024
  • By author-avatar jeff
The Chinese government will likely take action to retain the country’s leading position in the battery sector. State-owned media reported that China may offer CNY6 billion (US$844 million) to six major battery and EV makers to facilitate all-solid-state battery R&D.

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30 May
Latest News and Trends

HBM competition (1): advanced packaging technology divergence explained

  • May 30, 2024
  • By author-avatar jeff
High Bandwidth Memory (HBM) is a graphic memory with high bandwidth. Its main function is to support High-Performance Computing (HPC) or high-speed parallel computing with CPU/GPU in Artificial Intelligence (AI) computing.

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