Samsung Electronics is reportedly developing a new mobile chip packaging method aimed at improving thermal efficiency in its Exynos processors, as the company works to strengthen the competitiveness of its proprietary mobile silicon. The South Korea-based company is exploring a side-by-side packaging technology, internally dubbed SbS, that places the application processor and memory chips adjacent to one another rather than stacking them vertically.
AOC has officially unveiled the AOC AGON Pro AGP277QKD, a next‑generation gaming monitor designed to redefine competitive play with breakthrough WOLED technology and unprecedented refresh‑rate performance. The 26.5-inch display introduces a dual‑mode system (DFR) capable of delivering QHD resolution at 540Hz or HD resolution at a staggering 720Hz, positioning it among the fastest consumer gaming…
LG Electronics will introduce the LG Gallery TV, a new lifestyle screen designed to bring a gallery-quality atmosphere into the home, at CES 2026. Aimed at interior-conscious consumers, the Gallery TV is positioned as a dedicated canvas that complements LG’s Gallery+ service, which offers a rotating library of more than 4,500 pieces of content. The product blends display technology with…Samsung Electronics is reportedly on track to post sharply higher operating profit in the fourth quarter of 2025 as demand tied to artificial intelligence infrastructure lifts memory chip prices. The reports, compiled by South Korean outlets including Korea Economic Daily and EBN and citing industry sources, said Samsung’s preliminary fourth-quarter operating profit is expected to exceed KRW20 trillion, a level that would mark the first time a South Korean company has crossed that threshold in a single quarter.
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