In the InnoVex Exploring the Future of AI Forum on June 5 during COMPUTEX 2024, three prominent figures—Dr. Ettikan K Karuppiah from Nvidia, Hamid Arabzadeh of Canadian silicon photonic firm RANOVUS Inc., and Albert Liu from Kneron—shared insights on the future of AI and their solutions to meet the demand of exponential growth in AI computing. Their discussions highlighted significant advancements and the transformative potential of AI across various industries.

PC industry players are eagerly anticipating the arrival of AI PCs to drive a new wave replacement cycle, with Microsoft defining specifications for AI PCs under the Copilot+ PC label that includes the integration of NPUs and chip capabilities reaching 40+ TOPS.

据韩媒报道，华为将推出比三星电子更早发布的三折叠手机。虽然三星电子已具备相关技术和生产能力，但在推出新产品方面仍保持谨慎态度。业内人士预计，三星电子将在苹果进入折叠手机市场时，推出三折叠新产品。预计苹果将在2026年首次推出折叠iPhone。