Samsung Electronics, in collaboration with Intel, recently launched a new generation of desktop PCs called the “All-in-One Pro” in South Korea. By using AI, it aims to compete with Apple’s iMac and expand its AI end-user ecosystem.
The 2024 AI Expo, held at the Expo Dome in Taipei Expo Park from April 24th to 26th showcased cutting-edge AI innovations in smart manufacturing. Three keynote speeches, each unveiling groundbreaking AI solutions, stole the spotlight and underscored the transformative power of artificial intelligence in revolutionizing traditional manufacturing processes.
Nvidia’s GTC 2024 has confirmed the architecture of AI GPU. However, the demand for water cooling is increasing along with the growth of computing power. Where 1,000 watts were deemed as the ceiling of server Thermal Design Power (TDP), they are likely to become the floor of heat dissipation in the future.
Notebook production in Vietnam has increased dramatically, making the country the second largest source of imports to the US behind China, according to government sources.
As air cooling grew insufficient for the heat dissipation of datacenters when running AI applications, L2A and L2L cooling methods are likely to see rising penetration to datacenters in the upcoming years.
Government sources indicate that the proportion of servers imported from China to the US declined from 18.8% in 2017 to 1.7% in 2023, based on trade dynamics over the past five years.