Russia falls behind US and China in AI race amid sanctions, brain drain

Russia has fallen behind China and the US in artificial intelligence (AI) development, hindered by supply restrictions on critical hardware, international sanctions, and a significant outflow of skilled professionals. Despite President Vladimir Putin’s repeated calls for Russia to lead in the AI field, experts widely acknowledge that catching up is no longer feasible.

Continue reading

Topco Scientific to showcase key semiconductor materials and equipment at SEMICON Japan

The SEMICON Japan 2025 exhibition is set to take place in Tokyo from December 17 to 19, 2025, with Topco Scientific (TSC) and its Japanese subsidiary Shunkawa participating alongside nine semiconductor suppliers from Taiwan, the US, and Japan. Together, they will showcase critical materials and equipment covering semiconductor front-end processing, power modules, and advanced packaging, as well as integrated solutions for smart energy-saving monitoring systems.

Continue reading

SK Hynix pivots to general-purpose DRAM with tenfold 1c capacity surge

Rumors have risen that SK Hynix is accelerating the expansion of its 10nm-class sixth-generation 1c DRAM capacity. Previously, to concentrate on producing high-bandwidth memory (HBM), SK Hynix had successively notified major customers that it would reduce general-purpose DRAM supply. However, now that general-purpose DRAM prices have risen sharply, the company’s strategy also appears to be undergoing adjustments.

Continue reading

Trend Micro sees high AI cybersecurity interest but limited orders

Trend Micro predicts that enterprise protection priorities in 2025 will be closely linked to AI technology development, but the market for actual implementation is still in its early stages. General Manager Bob Hung said that while customer inquiries about AI cybersecurity solutions are very high, actual order volumes remain limited. At this stage, revenue contributions still primarily come from traditional cybersecurity products.

Continue reading