Taiwan IC designers in rack-level AI delivery
Rack-level delivery becomes a mainstream trend in cloud AI compute; MediaTek joins TPU design, influencing Taiwan’s IC design status.
12
Mar
12
Mar
JetCool, Broadcom partner on liquid cooling for AI chips
JetCool, a subsidiary of Flex, has partnered with Broadcom to develop liquid cooling solutions for next-generation AI processors, according to a press release issued March 11. The collaboration aims to address rising thermal demands as AI chip power densities continue to increase.
12
Mar
Asustek posts record NT$44.6 billion profit in 2025, server revenue to double in 1Q26
Benefiting from the continued expansion of its artificial intelligence (AI) server business, Asustek Computer reported a record full-year net profit after tax of NT$44.56 billion (approx. US$1.40 billion) for 2025, up 42% year over year. Looking ahead to the first quarter of 2026, Asustek Chief Financial Officer Nick Wu said the server business will maintain strong growth, with revenue expected to rise 50% to 100% sequentially and quadruple to quintuple compared with the same period last year.
12
Mar
UMC, HyperLight to mass-produce TFLN photonics chiplets for AI data centers
United Microelectronics Corporation (UMC) has partnered with startup HyperLight to mass-produce thin-film lithium niobate (TFLN) chiplets, aiming to improve data transmission speeds in artificial intelligence computing clusters and data centers.
12
Mar
Inside Macrohard, Musk’s AI venture built to run companies end-to-end
Elon Musk announced a joint venture between xAI and Tesla on March 11 aimed at building a system capable of emulating the operations of other companies. The move comes as autonomous AI agents draw growing attention from leading tech companies — and concern from those who fear they could upend the software industry or displace white-collar workers entirely.
12
Mar
Semco seen supplying ABF substrates for Tesla AI chips via Samsung foundry
Samsung Electro-Mechanics (Semco) is expected to supply ABF substrates for Tesla’s next-generation artificial intelligence chips that Samsung Electronics plans to manufacture at its Taylor, Texas foundry, according to Chosun Biz and other Korean media reports.
12
Mar
Nvidia expands GPU market share as AIB shipments rise despite increased costs
Nvidia strengthened its dominance in the add-in-board (AIB) GPU market in the fourth quarter of 2025, capturing a record 94% market share even as overall shipments dipped amid rising memory prices and tariff pressures, according to Jon Peddie Research.
12
Mar
Ardentec launches ASIC wafer test collaboration; new Longtan capacity to be ready by 2H26
Semiconductor testing firm Ardentec is optimistic about its future operations, driven by sustained strong orders in communication applications. The company expects a resilient first quarter of 2026 with utilization rates around 70%. Meanwhile, new AI ASIC wafer test capacity at its Longtan plant will gradually come online in the second half of 2026, serving as a key growth driver for the full year.
12
Mar
Middle East conflict rattles energy markets, squeezes IC distributors
The ongoing Middle East conflict is disrupting global oil and natural gas supplies and triggering an energy crisis that has pushed up international crude prices. Market expectations for higher inflation have risen, potentially delaying the US Federal Reserve’s timeline for interest rate cuts, industry participants say.
12
Mar
Middle East conflict raises helium supply risks for South Korean chipmakers
Samsung Electronics and SK Hynix are reviewing their helium supply strategies as tensions in the Middle East disrupt key logistics routes, raising concerns over the availability of a gas essential to semiconductor manufacturing.