Apple and Broadcom have extended their custom-chip partnership through 2031 under agreements expected to exceed US$30 billion, reinforcing Broadcom’s position as a critical Apple chip supplier.
TSMC is accelerating advanced packaging capacity expansion as supply remains tight, with market chatter indicating its CoWoS monthly output will reach at least 200,000 wafers in 2027. Equipment makers are still waiting for TSMC to finalize order allocation, a delay that is raising fears of price-cutting competition and delivery delays, as lead times run at least seven to nine months.
Luxshare Precision’s highly anticipated Hong Kong debut got off to a shaky start despite securing the city’s largest IPO of 2026, underscoring investor skepticism over the Apple supplier’s long-term transformation strategy.
It walks, it climbs, it reads gauges — and it’s 100% homegrown. Taiwan’s first domestically developed quadruped robot dog platform officially debuted on July 8, after the Industrial Technology Research Institute (ITRI) spent more than a year working with local academia and industry to complete two prototype models.
ASML, Imec and TSMC are collaborating in southern Taiwan to develop manufacturing equipment for two-dimensional (2D) semiconductor materials, marking a significant step toward commercializing technologies widely viewed as essential for extending Moore’s Law beyond the limits of conventional silicon scaling.
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