Once a low-cost commodity underpinning global computing, dynamic random-access memory (DRAM) has become a strategic chokepoint as AI-driven demand reshapes supply chains. With prices rising and conventional scaling nearing its limits, Taiwanese researchers—backed by government funding—are racing to develop next-generation memory technologies that promise higher density, lower power consumption, and resilience in extreme environments.

Dublin-based semiconductor startup CHIPX plans to build an 8-inch gallium nitride on silicon carbide wafer fabrication plant in Malaysia to meet rising demand from artificial intelligence (AI) data centers and high-voltage power electronics, CEO and founder Chinmoy Baruah told DIGITIMES Asia. The project aims to establish a front-end manufacturing presence in Southeast Asia, with the company expecting to reach key milestones beginning in January 2026.

As cybercriminals gain access to increasingly more computing power capable of breaking existing encryption algorithms in seconds, the standard for cybersecurity has shifted. It is no longer measured by how long it can hold but by ensuring attackers gain absolutely nothing. Post-quantum cryptography (PQC) security chips will therefore adopt a scorched-earth policy to guarantee that critical data cannot be accessed.

The rapid growth of generative AI and large-scale models has significantly increased power consumption in computing chips, pushing thermal management into critical focus. High-end AI accelerators now consume power at kilowatt levels, producing concentrated heat fluxes that challenge existing cooling methods, potentially limiting performance and reliability across data center systems.