Speculation over Tesla’s possible return to TSMC for advanced self-driving chips

TSMC held its in-person Technology Symposium with a virtual event in parallel for the first time in 2022, showcasing its industry-leading advanced logic technology, specialty technology, and TSMC 3DFabric advanced system integration service. Tesla was among a total of 37 heavyweight customers around the world invited to share their success stories of collaboration with TSMC at the event, sparking speculation over whether this would herald the EV giant’s return to the foundry for automotive chips fabrication.

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Japanese semiconductor packaging material leader to expand production in China

Sumitomo Bakelite, a leading Japanese manufacturer of synthetic plastics used in IC packaging, has announced a plan to build a new factory in China, investing JPY6.6 billion (US$45 million) in total. The new factory is scheduled to complete in 2023, and begin production in 2024, raising the capacity of packaging materials in China by 30%, according to the Japanese company.

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