The isolation of graphene in 2004 sparked widespread expectations that two-dimensional (2D) materials could fundamentally reshape electronic devices. Graphene and transition metal dichalcogenides (TMDs) have since enabled progress in niche applications and research prototypes. Yet their impact on mainstream logic devices remains limited. The long-anticipated use of 2D materials to sustain Moore’s Law through transistor channel integration has yet to materialize at scale.

As AI workloads reshape data center design, performance is no longer defined solely by computing power. Thermal management has emerged as an equally decisive battleground. Unlike traditional CPU-centric systems, modern AI servers rely heavily on GPUs and specialized accelerators, each drawing hundreds of watts per chip. The resulting thermal density far exceeds the limits of conventional air-cooling, turning heat dissipation into a core infrastructure challenge rather than a peripheral engineering concern.

Rising memory prices are prompting end customers to procure notebooks early, a shift that is expected to keep shipments steadier than usual during the traditionally weak first half of 2026, even as brands are set to raise their end notebook prices to reflect the increasing costs, according to sources from the notebook supply chain.

Apple has reportedly kicked off an OLED panel development program for the iMac, with South Korean outlet The Elec citing industry sources saying the company has sent Requests for Information (RFI) to Samsung Display (SDC) and LG Display (LGD).