Turn Cloud shifts to AI infrastructure

Turn Cloud Technology is accelerating its transformation from a solution as a service (SolaaS) provider into an AI infrastructure provider for physical spaces, as demand for digital transformation across real-world venues continues to rise. The company says its new Tomorrow Space (TSpace) architecture will anchor its next phase of growth.

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South Korea bets on southwest semiconductor cluster, but key hurdles remain

South Korea on June 29 unveiled a large-scale investment plan for the country’s Honam region in the southwest, which mainly covers the city of Gwangju and North and South Jeolla provinces, including semiconductor clusters for Samsung Electronics and SK Hynix, AI data centers, and regional infrastructure. The plan is seen as a key move by the South Korean government to respond to surging AI chip demand, excessive industrial concentration in the Seoul capital area, and pressure for balanced regional development.

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Medical demand, multimedia shipments drive Sonix recovery as drone strategy gains traction

With supply chain inventory normalization largely complete, Sonix Technology (Sonix) has seen business momentum recover. The MCU supplier is benefiting from resilient demand for microcontrollers used in medical monitoring devices and steady shipments of multimedia image-processing chips, giving it better order visibility for 2026 than in previous years. Meanwhile, the company’s drone business has entered niche commercial and industrial applications, providing a stepping stone toward higher-end markets.

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‘Switchblade’ drone maker AeroVironment deepens Taiwan supply chain ties

US drone maker AeroVironment has worked closely with Taiwan-based supply chain partners over the past three years, with the company noting that many of its product components are now co-developed and manufactured by both sides. Moreover, the defense tech company has also established a direct communication channel in Taiwan in recent years to support Taiwan’s national defense resilience program.

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BOE targets AI packaging with Micro LED optical interconnect and glass substrate CPO

BOE, China’s leading display panel maker, is accelerating its move into next-generation packaging technologies for the AI era. The company recently disclosed that it has formed a dedicated project team for Micro LED optical interconnect systems and glass substrate-based co-packaged optics (CPO), working with ecosystem partners on early-stage technology research to advance optical interconnect and glass substrate CPO development.

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How TSMC quietly turned its supply chain into a ‘second fleet’

TSMC has accelerated efforts to localize its supply chain in recent years, using joint development, joint validation, and long-term partnerships to help Taiwanese equipment, materials, and chemical suppliers enter the advanced semiconductor supply chain. The move is steadily building a more resilient and complete local supply system, with both CoWoS and panel-level advanced packaging (CoPoS) now spawning a “second fleet.”

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Microsoft launches US$2.5 B unit to guide enterprise AI adoption using embedded engineers

Microsoft unveiled plans for a new business unit called “Microsoft Frontier Company,” which is aimed at helping large organizations move beyond pilot projects and turn AI investments into measurable business results. The initiative echoes new services offered by other AI firms like OpenAI and Amazon Web Services (AWS) to embed engineers within enterprises and guide their AI adoption.

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