Japan plans 600-kilometer quantum communication network by 2027

Following the lead of China, the European Union (EU), and South Korea, Japan has unveiled plans to build its own long-distance quantum communication network. The first phase will link the country’s three major cities—Tokyo, Nagoya, and Osaka—covering a distance of 600 kilometers. Construction is expected to be completed by early 2027, with field testing planned later that year. The initial rollout will focus on sectors where confidentiality is critical, such as healthcare and finance, to establish a Japan-specific quantum communication standard by 2030.

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Google’s TPU shakes up ASIC market, challenging Nvidia’s lead

Google’s push to expand its Tensor Processing Unit platform is drawing renewed attention across the AI chip sector, prompting debate over whether the company intends to challenge Nvidia’s dominance or secure a strong position as the market’s second supplier. Industry insiders say Google’s system-level strategy, which emphasizes full-stack integration over chip-only sales, could reshape competition for application-specific integrated circuit developers.

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Liquid cooling opportunities bring optimism for Walrus Pump in 2026

Raymond Huang, chairman of water pump leader Walrus Pump, stated that 2026 will see four main growth drivers: this includes the launch of the new Kaohsiung Luzhu Global Factory, industrial water pumps entering the supply chains of major US and Japanese machine tool makers, shipments of server-grade technology pumps, and the launch of newly developed submersible pumps. The company is very optimistic about its 2026 business outlook.

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Cheng Mei delivers first CoPoS equipment to ASE

Competing with leading players, Cheng Mei Instrument Technology recently delivered the first CoPoS measurement and inspection equipment to the ASE Group, aiming to break KLA Corporation’s near-monopoly in the equipment market. Cheng Mei Chairman Tony Tsai stated that in recent years, the company has been aggressively entering the advanced packaging field. He estimates that in 2025, measurement and inspection equipment in the semiconductor sector will account for roughly 60–70% of revenue, with 2026 expected to exceed 70%.

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Rapidus reportedly plans second Hokkaido fab for 1.4nm chips as funding gap widens, but company pushes back on timeline

Rapidus plans to begin construction on a second fabrication plant in Chitose, Hokkaido, in fiscal 2027 to produce 1.4nm and eventually 1nm chips, according to reports from Nikkei and Yomiuri Shimbun. The move underscores Japan’s push to return to the front of advanced logic manufacturing, even as Rapidus works to complete its 2nm process and secure the funding required to sustain its roadmap. However, the company has since denied this reported timeline.

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Samsung Display cautious on OLEDoS ramp as yields stay low

Samsung Display has started producing OLED on Silicon panels for extended-reality devices, but the company is holding back on mass production as low yields and a still-nascent XR market limit near-term demand, according to people familiar with the matter. Analysts say the supplier is choosing to refine its microdisplay technology while waiting for the market to reach a level that can support larger volumes.

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Gigastorage advances AI cooling, CGM medical devices, and green energy

At its investor conference on November 27, 2025, Gigastorage Corporation shared details regarding its strategic shift from its early photovoltaic (PV) business toward AI computing, cooling, and personal health micro-sensing. In the HPC and AI fields, Gigastorage has invested in direct forming technology (DFT). This technique leverages the high hardness of diamond abrasives to directly machine deep, tall two-dimensional fin structures onto heat-dissipating materials, improving thermal resistance performance by approximately 20%. It overcomes the technical bottlenecks of traditional cooling solutions, allowing fins to be directly integrated into GPU modules while precisely controlling the base thickness below 0.2mm, targeting top-tier applications such as HPC and vertical AI cooling.

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