Micron Technology said it has signed an exclusive letter of intent to acquire Powerchip Semiconductor Manufacturing Corporation’s P5 fabrication site in Tongluo, Taiwan, in a cash transaction valued at US$1.8bn.
Micron is scheduled to begin construction on its planned New York state megafab site on January 16, 2026, advancing its US manufacturing expansion even as executives warn that new capacity will take years to meaningfully ease tight conditions in the global memory market.
Amkor Technology, the US-based semiconductor packaging and testing company, said it will close its Hakodate plant in northern Japan by December 2027, citing weak demand stemming from a slowdown in the global electric vehicle (EV) market. The factory, located in the town of Nanae in Hokkaido, specializes in packaging chips used in automobiles.
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