02
Jun
02
Jun
Xiaomi’s risk in India rising amid regulator scrutiny
Amid the dispute over royalty payment between the Indian government and Xiaomi, a lobby group composed of technology companies criticized the Indian enforcement agencies for lacking understanding of how the technology industry works, which may increase the risk of other technology firms operating in India.
02
Jun
Taiwan makers in China still at lockdown risks, says MOEA
While the government of Shanghai on June 1 lifted its COVID lockdown, Taiwan-based manufacturers in the Chinese city and surrounding areas will still face risks arising from uncertainties, according to evaluation by Taiwan’s Ministry of Economic Affairs (MOEA).
02
Jun
Research Insight: Infineon SiC products aim at auto, industrial applications
Infineon Technologies has showcased its CoolSiC MOSFETs that support two-way charging during the Computex 2022 that closed in Taipei on May 27, highlighting its deployments for the automotive sector.
02
Jun
China to boost car sales with new stimulus
The Chinese government recently announced a new stimulus package for the automotive industry, which is expected to boost mainly sales of traditional vehicles with small gasoline-powered engines, according to Chinese media reports.
02
Jun
QIC Inside Investor Relation Series (9): How to construct an IR plan?
Planning an efficient and effective IR program is one of the most important responsibilities of IRO and investor relations team at any company. Based on our hybrid experience working with micro/small-cap companies with no analyst coverage, to larger-cap companies with more coverage, and incorporating feedback from institutional investors, we recommend considering the following when building an IR plan.
02
Jun
Global semiconductor equipment billings grow 5% in 1Q22, says SEMI
Global semiconductor equipment billings grew 5% on year to US$24.7 billion in the first quarter of 2022, according to SEMI.
02
Jun
ASE intros VIPack advanced packaging solutions
Advanced Semiconductor Engineering (ASE), a member of ASE Technology, has introduced VIPack as its family of vertically integrated package solutions including 3D heterogeneous integration devices.
02
Jun
Taiwan and US announce Initiative on 21st-Century Trade
Taiwan government held a high-profile press conference on June 2 to announce the launch of the US-Taiwan Initiative on 21st-Century Trade, and the US Trade Representative Office also released a press release later on the same day, pledging on-going engagement with stakeholders to advance and deepen the US-Taiwan economic and trade relationship.
02
Jun
Macronix expands automotive NOR flash market presence
Macronix International has gradually expanded its share of global car-use NOR flash market with its offerings already on a par with bigger international counterparts including Infineon, according to Miin Wu, chairman for the Taiwan-based memory chipmaker.