Smart glasses race enters new phase as AI ecosystems eclipse hardware specs

The global smart glasses market is entering a decisive new stage in the second half of 2026, with competition expanding well beyond Meta’s early dominance. Industry attention is rapidly shifting from hardware specifications to AI capabilities, ecosystem integration and everyday usability, while mounting pricing pressure and growing regulatory scrutiny are reshaping the competitive landscape.

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Compeq acquires Guanyin site for NT$2.09 billion to expand optical and space data center PCB capacity

HDI PCB maker Compeq Manufacturing has approved the acquisition of a new manufacturing site in Taoyuan’s Guanyin Industrial Park for approximately NT$2.09 billion (US$64.5 million), positioning itself to support customers developing next-generation optical modules and satellite applications. The facility is intended to provide additional manufacturing capacity for optical interconnects and space data center applications in line with customers’ product development and mass-production schedules between 2027 and 2028.

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Commentary: Apple sues OpenAI, but Trump holds the whistle

Apple has filed a sharp antitrust-style complaint against OpenAI, turning a once-celebrated AI partnership into a legal clash over strategy, supply chains, and future hardware control. Behind the lawsuit lies a broader contest over who will shape the next wave of AI devices, and whether the Trump administration’s “America First” agenda can help both sides find common ground.

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Grenergy listing could sharpen group’s role in AI and power supply markets

Grenergy Enterprise is set to list on the emerging stock board on July 21, in a move that could highlight how its parent, Changs Ascending Enterprise, is dividing the group’s lithium iron battery businesses to capture demand from AI data centers and industrial power systems. Changs Ascending will hold about 55% of Grenergy and will continue to license the core LFP cathode material patent technology.

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Intel reassigns global fabs, eyes early 14A and EMIB-T AI wins

Intel has accelerated its global footprint reset for 2026 after receiving investments from the US government, SoftBank, and Nvidia. Supply-chain sources said the company has relaunched its worldwide manufacturing sites, pushing ahead with Intel 18A mass production, 14A and high-NA EUV development, and advanced packaging programs including EMIB, EMIB-T, Foveros, and hybrid bonding (HB). The goal is to build an end-to-end manufacturing platform spanning advanced process nodes, chiplets, heterogeneous integration, and backend assembly and testing.

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Tai-Saw leverages frequency-component portfolio to expand into optical communications, LEO satellites and drones

As frequency-control components move toward higher frequencies and smaller form factors, Tai-Saw Technology is leveraging synergies across its diversified product portfolio to expand into optical communications, low Earth orbit (LEO) satellites and drone supply chains. Tight industry capacity and rising raw material costs, however, have extended lead times for some products to 10–12 weeks, prompting the company to gradually expand production.

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