Hanmi Semiconductor has launched FC Bonder 3.5, a new flip-chip bonding tool for AI system semiconductor packaging, as the South Korean equipment maker looks to broaden its advanced packaging business beyond TC bonders for high-bandwidth memory and supply global foundry and OSAT customers, ETNews and Yonhap reported.
The Gigabyte MO32U24 was announced at CES 2026 earlier this year, and as of today, it goes on sale. The monitor has a 31.5-inch QD-OLED panel with a 4K resolution with 10-bit color bit depth, and 99% DCI-P3 color space coverage. HDR performance is certified at VESA DisplayHDR True Black 500, with peak brightness reaching up to 1300 nits in HyperNits mode for impactful highlights. Gigabyte’s new…
The AOC CQ27G4S features a 27-inch Fast VA panel with a 1500R curvature that combines QHD resolution with a dual‑mode refresh system that reaches up to 320Hz at 2560×1440 and an ultra‑fast 400Hz at 1280×720, giving players the flexibility to prioritize clarity or raw speed depending on the title. Further panel inherent strengths are on full display here: a 5000:1 static contrast ratio, 350 nits…No account yet?
Create an Account
